Light-emitting apparatus and method for manufacturing same

ABSTRACT

A light-emitting apparatus including: a substrate; an LED chip mounted on a first surface of the substrate; a fluorescent material-containing layer containing a first fluorescent material, which fluorescent material-containing layer is provided above the first surface of the substrate so as to cover the LED chip; and a color-adjusting fluorescent layer that contains a second fluorescent material, which color-adjusting fluorescent material layer is formed in a layer provided on an outer side of the fluorescent material-containing layer in an emission direction, the color-adjusting fluorescent layer being formed in dots. Thus, the present invention provides a light-emitting apparatus and a method for manufacturing the same, each making it possible to carry out fine color adjustment so as to prevent a subtle color shift that occurs due to a factor such as a difference in concentration of a fluorescent material or the like.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.12/706,178, filed Feb. 16, 2010, now allowed, which claims the benefitof priority to Japanese Patent Application No. 2009-031790 filed on Feb.13, 2009, the entire contents of each of which are hereby incorporatedby reference.

TECHNICAL FIELD

The technology presented herein relates to (i) a light-emittingapparatus that includes a light-emitting element (semiconductorlight-emitting device) in combination with a fluorescent material and(ii) a method for manufacturing the light-emitting apparatus.Particularly, the present invention relates to a technique directed tofine color adjustment which causes the light-emitting apparatus to emitlight having a given color.

BACKGROUND ART

Conventionally, there is known a light-emitting apparatus that includesa blue LED (light-emitting diode, light-emitting element) in combinationwith a fluorescent material. In the light-emitting apparatus, lightemitted from the blue LED is converted into light having a color such asyellow by the fluorescent material, and then blended with light whichhas been emitted from the blue LED but has not been subjected toconversion by the fluorescent material, so that light having a givencolor can be produced. The fluorescent material emits, when irradiatedwith excitation light emitted from the light-emitting element,fluorescent light having a longer wavelength than the excitation light.In the light-emitting apparatus adopting a configuration describedabove, light to be emitted has a color and brightness which are variedbased on a balance between the light emitted from the blue LED andfluorescent light emitted from the fluorescent material. On this regard,it is important to control the balance between them.

For example, Patent Literature 1 discloses a method for manufacturing alight-emitting apparatus, which method is for manufacturing thelight-emitting apparatus by adjusting a brightness of and a color oflight to be emitted from the light-emitting apparatus. FIGS. 18( a)through 18(c) are views each showing a step of the method according toPatent Literature 1 for manufacturing a light-emitting apparatus 500.

As shown in FIG. 18( a), a given current is applied to a light-emittingapparatus blank 503 (light-emitting apparatus to which no coating agentis applied) so that white light 504 is emitted, which light-emittingapparatus 503 is formed by: mounting a blue LED 502 on a resin substrate501; and sealing the blue LED 502 by a resin material containing afluorescent particle. Then, the white light 504 emitted from a surfaceof the resin material is measured by a light-emission measurementapparatus 505.

A subsequent step of the method calculates, based on a measurement valueof the white light 504 thus obtained by measurement with thelight-emission measurement apparatus 505, a pigment particle and a filmthickness each contributing to emission of pastel light having a desiredintermediate color. The measurement value of the white light 504 isvaried in a wavelength component and/or a luminance, depending on (i) awavelength and a luminance of light emitted from the blue LED 502constituting the light-emitting apparatus 503 or (ii) a density of thefluorescent particle contained in the resin material.

A subsequent step of the method controls, based on a result from thecalculation, an applying apparatus 506 is controlled so that a coatingmaterial 507 is sprayed to a surface of the light-emitting apparatusblank 503, as shown in FIG. 18( b). By this, a coating film 508 madefrom the coating material 507 is formed on the surface of thelight-emitting apparatus blank 503, as shown in FIG. 18( c). By aboveprocesses, the light-emitting apparatus 500 is manufactured. Thelight-emitting apparatus 500 can emit, from its surface, the pastellight having the desired intermediate color.

Patent Literature 2 discloses a method for manufacturing alight-emitting apparatus, which method includes: covering a blue LED bya buffer layer (light-transmissive resin); and then applying afluorescent material to the buffer layer by an ink jet printing method.The method disclosed in Patent Literature 2 provides the blue LED in apackage configured in a dot matrix manner, and then forms, above thepackage, the buffer layer made of an epoxy resin. Subsequently, themethod discharges, via an ink jet printer head to only that part of thebuffer layer which is formed above an aperture section of the package,alcohol which contains an organic fluorescent dye or a fluorescentparticle, so that a fluorescent material is applied on the buffer layer.

After the above, a subsequent step of the method performs scanning by anoptical sensor while the blue LED emits light, so as to store, in amemory, pieces of information on a color of the light emitted from theblue LED and on a position of the blue LED. Subsequently, a step of themethod compares the color of light thus read out by the optical sensorwith a referential color of emission light. In this case, if thefluorescent material is small in amount, the method calculates an amountby which the fluorescent material requires to be applied. Then, based onthe amount thus calculated, a step of the method again applies, via theink jet printer head to that part of the buffer layer which isdetermined to have the small amount of the fluorescent material, adesired amount of the fluorescent material. By above processes, thecolor of emission light is adjusted.

CITATION LIST

-   Patent Literature 1-   Specification of Japanese Patent No. 4030069 (Publication    Registration Date: Oct. 26, 2007)-   Patent Literature 2-   Specification of Japanese Patent No. 3546650 (Publication    Registration Date: Apr. 23, 2004)

SUMMARY

There is a problem in that with the conventional methods according toPatent Literatures 1 and 2 for manufacturing a light-emitting apparatus,it is impossible to prevent a subtle color shift that occurs due to afactor such as a difference in concentration of the fluorescencematerial or the like. That is, according to the conventional methods, anentire surface of the emission surface of the light-emitting apparatusis covered by spraying or an ink jet printing method. Therefore, it isharder that fine color adjustment is carried out.

The technology presented herein is made in view of the problem, and afeature of the present technology is to provide (i) a light-emittingapparatus including a light-emitting element in combination with afluorescent material and (ii) a method for manufacturing thelight-emitting apparatus, each allowing fine color adjustment forpreventing a subtle color shift that occurs due to a factor such as adifference in concentration of the fluorescent material or the like.

In order to attain the above feature a light-emitting apparatus of anexample embodiment presented herein is configured so as to be alight-emitting apparatus including: a substrate; a light-emittingelement mounted on a mounting surface of the substrate; a fluorescentmaterial-containing layer containing a first fluorescent material, whichfluorescent material-containing layer is provided above the mountingsurface of the substrate so as to cover the light-emitting element; acolor-adjusting fluorescent layer containing a second fluorescentmaterial, which color-adjusting fluorescent layer is provided on anouter side of the fluorescent material-containing layer in an emissiondirection, the color-adjusting fluorescent layer being formed in dots.

Further, in order to attain the feature a method according to an exampleembodiment for manufacturing the light-emitting apparatus is configuredso as to be a method for manufacturing a light-emitting apparatus thatincludes: a substrate; a light-emitting element mounted on a mountingsurface of the substrate; a fluorescent material-containing layercontaining a first fluorescent material, which fluorescentmaterial-containing layer is provided above the mounting surface of thesubstrate so as to cover the light-emitting element; and acolor-adjusting fluorescent layer containing a second fluorescentmaterial, which color-adjusting fluorescent layer is provided on anouter side of the fluorescent material-containing layer in an emissiondirection, the method including the steps of: (i) forming thefluorescent material-containing layer on the mounting surface of thesubstrate so that the fluorescent material-containing layer covers thelight-emitting element mounted on the mounting surface of the substrate;(ii) measuring, after the step (i), a color property of light that isemitted from the light-emitting element via the fluorescentmaterial-containing layer; and (iii) forming, based on the colorproperty measured in the step (ii), the color-adjusting fluorescentlayer in dots in a layer provided on an outer side of the fluorescentmaterial-containing layer in the emission direction.

According to the configurations above, the color-adjusting fluorescentlayer is formed in dots. Thus, fine color adjustment can be carried outso as to adjust, to a target color, a color of light emitted from thelight-emitting apparatus. Therefore, it is possible to prevent a subtlecolor shift that occurs due to a factor such as a difference inconcentration of a fluorescent material or the like.

Because the color-adjusting fluorescent layer is formed in dots insteadof being formed so as to entirely cover a surface, it is possible toreduce an application amount of the second fluorescent material to asmall amount. This further brings about an effect that prevents adeterioration in light beam that occurs due to the second fluorescentmaterial having been applied.

As described so far, the light-emitting apparatus of the exampleembodiments presented herein is configured so that the color-adjustingfluorescent layer containing the second fluorescent material is formedin dots in a layer provided on an outer side of a fluorescentmaterial-containing layer in the emission direction.

On the other hand, the method according to the present embodiment formanufacturing a light-emitting apparatus includes the steps of: (i)forming the fluorescent material-containing layer on the mountingsurface of the substrate so that the fluorescent material-containinglayer covers the light-emitting element mounted on the mounting surfaceof the substrate; (ii) measuring, after the step (i), a color propertyof light that is emitted from the light-emitting element via thefluorescent material-containing layer; and (iii) forming, based on thecolor property measured in the step (ii), the color-adjustingfluorescent layer in dots in a layer provided on an outer side of thefluorescent material-containing layer in the emission direction.

Accordingly, the color-adjusting fluorescent layer is formed in dots.Thus, fine color adjustment can be carried out so that a color of lightemitted from the light-emitting apparatus is adjusted to a target colorof light. This brings about an effect that reduces a subtle color shiftthat occurs due to a factor such as a difference in concentration of thefluorescent material or the like.

Because the color-adjusting fluorescent layer is formed in dots insteadof being formed so as to entirely cover a surface, an application amountof the second fluorescent material can be reduced to a small amount.This further brings about an effect that reduces a deterioration in alight beam that occurs due to the second fluorescent material havingbeen applied.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a perspective view showing one example of a configuration ofan ink jet apparatus.

FIG. 2( a) is a top view showing a light-emitting apparatus inaccordance with one embodiment.

FIG. 2( b) is a cross sectional view showing the light-emittingapparatus in accordance with the one embodiment.

FIG. 3( a) is a view showing a step of a method for manufacturing thelight-emitting apparatus.

FIG. 3( b) is a view showing a step of the method for manufacturing thelight-emitting apparatus.

FIG. 3( c) is a view showing a step of the method for manufacturing thelight-emitting apparatus.

FIG. 3( d) is a view showing a step of the method for manufacturing thelight-emitting apparatus.

FIG. 3( e) is a view showing a step of the method for manufacturing thelight-emitting apparatus.

FIG. 3( f) is a view showing a step of the method for manufacturing thelight-emitting apparatus.

FIG. 4 is a flow chart showing steps of the method for manufacturing thelight-emitting apparatus.

FIG. 5 is a graph showing CIE color coordinates of light emitted fromlight-emitting apparatuses.

FIG. 6 is a graph showing (i) a spectrum property of light emitted fromthe light-emitting apparatus including no color-adjusting fluorescentlayer and (ii) a spectrum property of light emitted from thelight-emitting apparatus including a color-adjusting fluorescent layer.

FIG. 7( a) is a top view showing another example of a configuration ofthe color-adjusting fluorescent layer of the light-emitting apparatus.

FIG. 7( b) is a top view showing still another example of aconfiguration of the color-adjusting fluorescent layer of thelight-emitting apparatus.

FIG. 8 is a view schematically showing one example of a configuration ofthe ink jet apparatus for applying a resin containing a fluorescentpowder.

FIG. 9 is an enlarged cross sectional view schematically showing acolor-adjusting fluorescent layer that is formed by use of the ink jetapparatus.

FIG. 10 is a top view showing a light-emitting apparatus in accordancewith another embodiment.

FIG. 11 is a top view showing another example of a configuration of acolor-adjusting fluorescent layer in the light-emitting apparatus.

FIG. 12( a) is a view showing a step of a method for manufacturing thelight-emitting apparatus.

FIG. 12( b) is a view showing a step of the method for manufacturing thelight-emitting apparatus.

FIG. 12( c) is a view showing a step of the method for manufacturing thelight-emitting apparatus.

FIG. 12( d) is a view showing a step of the method for manufacturing thelight-emitting apparatus.

FIG. 12( e) is a view showing a step of the method for manufacturing thelight-emitting apparatus.

FIG. 13 is a flow chart showing steps of the method for manufacturingthe light-emitting apparatus.

FIG. 14 is a graph showing CIE color coordinates of light emitted fromthe light-emitting apparatuses.

FIG. 15 is a cross sectional view showing a light-emitting apparatus inaccordance with still another embodiment of the present invention.

FIG. 16 is a top view showing the light-emitting apparatus.

FIG. 17 is a cross sectional view showing a light-emitting apparatus inaccordance with yet another embodiment.

FIG. 18( a) is a view showing a step for manufacturing a conventionallight-emitting apparatus.

FIG. 18( b) is a view showing a step for manufacturing the conventionallight-emitting apparatus.

FIG. 18( c) is a view showing a step for manufacturing the conventionallight-emitting apparatus.

DESCRIPTION OF EMBODIMENTS

A light-emitting apparatus of the present technology is a light-emittingapparatus including a light-emitting element in combination with afluorescent material, which light-emitting apparatus includes, on itsemission surface, a color-adjusting fluorescent layer for adjusting adifference between (i) a target color of light and (ii) a color of lightthat is emitted from the light-emitting apparatus, which color-adjustingfluorescent layer is formed by applying a liquid containing afluorescent material (hereinafter, also referred to as afluorescent-material containing liquid) by use of a fluorescent materialapplying apparatus. The following deals with Examples in each of which afluorescent material applying apparatus, which includes the same basicconfiguration as an ink jet apparatus developed for use in an ink jetprinter, is used. In the fluorescent material applying apparatus, anagent to be applied is not ink but a fluorescent material-containingliquid.

Note that in the present specification, the fluorescent materialapplying apparatus is referred to as an “ink jet apparatus”, which alsocan be referred to as a jet dispenser. Note also that a method forapplying the fluorescent material-containing liquid with the use of theink jet apparatus is referred to as an “ink jet print method”.

(Configuration of Ink Jet Apparatus)

FIG. 1 is a perspective view showing one example of a configuration ofan ink jet printer head 100 that is included in an ink jet apparatus foruse in the present invention.

As shown in FIG. 1, the ink jet apparatus includes the ink jet printerhead 100 via which a fluorescent material-containing liquid is appliedto a targeted object, the fluorescent material-containing liquidcontaining a particulate fluorescent material. The ink jet printer head100 is configured such that the fluorescent material-containing liquid,which has been introduced into a fine pressure chamber (chamber 103 intowhich a fluorescent material-containing resin is introduced), isdischarged via a nozzle 101 so as to be applied to the targeted objectsuch as an LED chip.

A method for increasing a pressure in the chamber 103 encompasses (i) amethod (piezo method) that operates a piezoelectric device (piezo) 102,and (ii) a method (thermal ink jet method) that instantaneouslyincreases a temperature of a part of the chamber 103 so as to generatebubbles, and discharges the fluorescent material by a pressure of thebubbles.

For application of the particulate fluorescent material, it ispreferable to prepare the particulate fluorescent material in a mannersuitable for printing by mixing it with a liquid-form resin such as aliquid-form silicone resin or a liquid-form epoxy resin, so that amixture of the particulate fluorescent material and the liquid-formresin can be applied by the ink jet printing method.

However, in a case where each particle of the particulate fluorescentmaterial is large in size with respect to the nozzle 101, the nozzle 101may be clogged with the particulate fluorescent material. Also, even ina case where each particle of the particulate fluorescent material issmall in diameter with respect to a diameter of the nozzle 101, thenozzle 101 tends to be clogged with the particulate fluorescent materialif particles of the particulate fluorescent material are not uniform indiameter.

In consideration of the above, in a case where the particulatefluorescent material is to be applied by the ink jet printing method, itis preferable to filter the particulate fluorescent material so thatparticles of the particulate fluorescent material have an uniform shapewith a diameter of approximately few μm. Further, in the case ofapplication of the particulate fluorescent material by the ink jetprinting method, it is more preferable to use the piezo method, whichoperates the piezoelectric device 102, than to use the thermal ink jetmethod, which utilizes the bubbles, because the piezo method isapplicable to larger particles of the particulate fluorescent material.Note that a liquid fluorescent material, such as a fluid fluorescentpigment, also can be discharged via the ink jet printer head 100 in theink jet apparatus.

First Embodiment

One embodiment of the present invention is described below withreference to the drawings.

(Configuration of Light-Emitting Apparatus)

FIG. 2( a) is a top view showing one example of a configuration of alight-emitting apparatus 10 in accordance with the present embodiment.FIG. 2( b) is a cross sectional view showing one example of aconfiguration of the light-emitting apparatus 10 in accordance with thepresent embodiment.

As shown in FIGS. 2( a) and 2(b), the light-emitting apparatus 10includes: a substrate 1; LED chips 3 each serving as a light-emittingelement; wires 4; a layer 5 that contains a fluorescent material(hereinafter, also referred to as a fluorescent material-containinglayer 5); a light-transmissive silicone resin layer 6 (layer thatcontains no fluorescent material); and a color-adjusting fluorescentlayer 7.

It is preferable that the substrate 1 be made from a material, whichprovides a high reflex of a first surface 2 (mounting surface) of thesubstrate 1. For example, it is suitable that the substrate 1 be asubstrate such as a ceramic substrate. The substrate 1 includes (i), onthe first surface 2, surface electrodes for wire bonding, and (ii), on asecond surface, a back electrode (which is not illustrated) connectableto an external circuit. Also, the substrate 1 has through-holes (whichare not illustrated) via each of which a surface electrode and the backelectrode are electrically connected to each other. On the first surface2 of the substrate 1, (i) the LED chips 3, (ii) the fluorescentmaterial-containing layer 5, (iii) the light-transmissive silicone resinlayer 6, and (iv) the color-adjusting fluorescent layer 7 are laminatedin this order from the first surface 2.

The LED chips 3 are of a blue LED having an emission peak wavelength of450 nm, but the present invention is not limited to this. For example,the LED chips 3 can be of an ultraviolet (near-ultraviolet) LED havingan emission peak wavelength of 390 nm to 420 nm. This makes it possibleto further improve an emission efficiency.

A plurality of the LED chips 3 (4 LED chips 3 in the present embodiment)are mounted (die-bonded) on the first surface 2 of the substrate 1. TheLED chips 3 are aligned at equal intervals, for example, and the LEDchips 3 are provided at respective given positions that make it possibleto satisfy a predetermined amount of light. An LED chip 3 has electrodes(anode electrode and cathode electrode) on its emission surface. The LEDchip 3 is mounted on the first surface 2 of the substrate 1 in a waythat the emission surface of the LED chip 3 and the first surface 2 ofthe substrate 1 do not face each other.

The wires 4 are made from, for example, gold. A wire 4 electricallyconnects the surface electrode of the substrate 1 with an electrode ofthe LED chip 3, and another wire 4 electrically connects anotherelectrode of the LED chip 3 with an electrode of another LED chip 3 thatis provided adjacent to the LED chip 3. By this, it is possible tosupply an electrical power to each one of LED chips 3 via the backelectrode of the substrate 1.

The fluorescent material-containing layer 5 is formed so as to cover theLED chips 3 and the wires 4. The fluorescent material-containing layer 5is made from a resin that contains a first particulate fluorescentmaterial (first fluorescent material). A concrete example of the firstparticulate fluorescent material is to be described later, but the firstparticulate fluorescent material is a fluorescent material that allowsthe light-emitting apparatus 10 to emit, in combination with a color oflight emitted from the LED chips, light of a predetermined color(chromaticity).

The light-transmissive silicone resin layer 6 is formed in ahemispherical dome shape so as to cover the fluorescentmaterial-containing layer 5 (that is, the LED chips 3, the wires 4, andthe fluorescent material-containing layer 5). The light-transmissivesilicone resin layer 6 is made from a light-transmissive silicone resin,and is a layer that contains no fluorescent material. The light-emittingapparatus 10 is configured such that a hemispherical dome shaped surface(spherical surface) of the light-transmissive silicone resin layer 6serves as an emission surface of the light-emitting apparatus 10.

The color-adjusting fluorescent layer 7 is formed in dots on thespherical surface of the light-transmissive silicone resin layer 6. Thatis, the color-adjusting fluorescent layer 7 is formed in dots in a layerprovided on an outer side of the fluorescent material-containing layer 5in an emission direction. The color-adjusting fluorescent layer 7 ismade from a resin that contains a second particulate fluorescentmaterial (second fluorescent material). A concrete example of the secondparticulate fluorescent material is to be described later, but thesecond particulate fluorescent material is a fluorescent material thatgives a predetermined color (chromaticity) to light emitted from thelight-emitting apparatus 10.

(Method for Manufacturing Light-Emitting Apparatus)

Next, the following describes a method for manufacturing thelight-emitting apparatus 10 having the configuration described earlier.

FIGS. 3( a) through 3(f) are views each showing a step of a process formanufacturing the light-emitting apparatus 10. FIG. 4 is a flow chartshowing steps of the process that includes a color adjustment step to beperformed in the light-emitting apparatus 10.

Note that the light-emitting apparatus 10 is first formed in a unitincluding a group of plural light-emitting apparatuses and then formedas an individual light-emitting apparatus by dicing peripheries (foursides) of each of the plural light-emitting apparatuses and separatingthe unit of the group of plural light-emitting apparatuses intoindividual light-emitting apparatuses. In accordance with necessity,members shown in FIG. 3 are simplified to an extent where clarity isreserved.

At first, the LED chips 3 are die-bonded to respective given positionsof the first surface 2 of the substrate 1 including members such as thesurface electrodes (step S 11).

Then, wire-bonding is carried out by use of the wires 4 (step S 12). Inthe step S 12, the wire-bonding is carried out sequentially to (i) apart between an electrode of an LED chip 3 and a surface electrode ofthe substrate 1 and (ii) a part between another electrode of the LEDchip 3 and an electrode of another LED chip 3. This provides aconfiguration as shown in FIG. 3( a).

Then, a resin 11 that contains a fluorescent particle is applied, whichresin 11 later constitutes a fluorescent material-containing layer 5(step S 13). Specifically, as shown in FIG. 3( b), a dam seat 111 isattached on the first surface 2 of the substrate 1, i.e., that surfaceof the substrate 1 on which the LED chips 3 have been mounted. When theresin 11, which is to be described later, is introduced, the dam seat111 serves to prevent the resin 11 from flowing and spreading out from agiven area. The dam seat 111 has through-holes 112 in each of which anLED chip 3 can be placed. In other words, a shape of the fluorescentmaterial-containing layer 5 is determined based on a shape of thethrough-holes 112 in the dam seat 111.

The dam seat 111 can be a resin seat to which an adhesive agent isapplied on one surface. This resin seat is made from a material such asTeflon (registered trademark), fluoro-rubber, or a silicone sheet. Inparticular, the fluoro-rubber is preferable because (i) it has a highelasticity, and (ii) the dam seat 111 made from fluoro-rubber can beeasily removed. The adhesive agent, on the other hand, is preferably anadhesive agent (i) via which the dam seat 111 can be easily attached tothe first surface 2 and (ii) which leaves no residue on the firstsurface 2 when the dam seat 111 is removed from the first surface 2.

After the dam seat 111 is attached to the substrate 1 so that each ofthe LED chips 3 is placed in a through-hole 112, the resin 11 isintroduced so as to fill the through-hole 112, as shown in FIG. 3( c).The resin 11 is a liquid silicone resin in which a first particulatefluorescent material is dispersed. In the present embodiment, the firstparticulate fluorescent material is a red fluorescent materialCaAlSiN₃:Eu and a green fluorescent material (Si.Al)₆(O.N)₈:Eu.

Note that the first particulate fluorescent material is not limited tothe above. For example, the first particulate fluorescent material cansuitably be a material such as BOSE (Ba, O, Sr, Si, Eu). Further, thefirst particulate fluorescent material can suitably be a material otherthan BOSE, such as SOSE (Sr, Ba, Si, O, Eu), YAG (Ce-activated yttrium,aluminum, garnet), a sialon ((Ca), Si, Al, O, N, Eu), or β sialon (Si,Al, O, N, Eu). Further, a nanoparticle fluorescent material whoseparticles have a diameter of 10 nm or smaller (e.g., InP material or GaNmaterial) is suitably used, because such material causes less nozzleclogging.

After introduction of the resin 11, the resin 11 is cured at 150° C. for120 minutes. Then, the dam seat 111 is removed. By above processes, thefluorescent material-containing layer 5 that covers the LED chips 3 andthe wires 4 is formed as shown in FIG. 3( d). A method for removing thedam seat 111 can be a method which holds one end of the dam seat 111 bya jig and then peels off the dam seat 111. With the method, it ispossible to remove that the resin 11 which has spread out from thethrough-hole 112, concurrently with removing the dam seat 111.

After the above, the light-transmissive silicone resin layer 6 is formed(step S 14). Specifically, the hemispherical dome shapedlight-transmissive silicone resin layer 6 is formed by using compressionmolding, as shown in FIG. 3( e).

According to the compression molding, cavities 122 each formed in afemale die 121 and having a hemispherical dome shape are filled with alight-transmissive silicone resin 12, which later constitutes thelight-transmissive silicone resin layer 6. Subsequently, the substrate 1is set to the female die 121 so that the fluorescent material-containinglayer 5 is placed in the cavities 122. Then, mold clamping is performedby use of a base mold 123, and the substrate 1 is kept at 150° C. forapproximately one minute so that the light-transmissive silicone resin12 is cured. After this, an after cure is carried out at 150° C. for twohours. By above processes, the light-transmissive silicone resin layer 6having a hemispherical dome shape and covering the fluorescentmaterial-containing layer 5 is formed on the first surface 2 of thesubstrate 1.

The following step measures a color property of light that is emittedfrom the light-emitting apparatus thus including the light-transmissivesilicone resin layer 6 (step S 15). The color property of light can bemeasured with a measurement apparatus that adopts a d/8 (diffusionillumination 8° light receiving system) optical system conforming to thecondition C of JIS 28722, DIN 5033 teil 7, ISOk772411.

FIG. 5 is a graph in which the CIE color coordinates are shown. Based onthe color property of light measured as described above, eachlight-emitting apparatus (the light-emitting apparatus having beensubjected to no color adjustment) thus including the light-transmissivesilicone resin layer 6 is categorized into one of color groupsrepresented by color regions (b), (a1), (a2), and (a3) shown in FIG. 5.Note that the number of light-emitting apparatuses which is categorizedin none of the four color groups is so small that these light-emittingapparatuses can be disregarded.

For example, with respect to a light-emitting apparatus that iscategorized in a color group corresponding to the color region (a1)(central color coordinates (x, y)=(0.292, 0.245)), color adjustment iscarried out so that light emitted from the light-emitting apparatus hasa color range within the color region (b).

Subsequently, onto the spherical surface of the light-transmissivesilicone resin layer 6, a resin liquid (fluorescent material-containingliquid) that contains a second particulate fluorescent material isapplied (step S 16), which resin liquid later constitute thecolor-adjusting fluorescent layer 7. Note that the second particulatefluorescent material and the resin liquid can be selected as appropriatebased on a desired color property of light. In some cases, the resinliquid containing the second particulate fluorescent material canadditionally contain a light diffusing agent such as an alumina fineparticle.

In order that light emitted from a light-emitting apparatus be light ofthe color region (b) having coordinates (x, y)=(0.303, 0.263), forexample, a green fluorescent material (Si.Al)₆(O.N)₈:Eu to serve as thesecond particulate fluorescent material is mixed with a silicone resinto serve as a resin liquid at a weight ratio of 2:100, so that a greenfluorescent material-containing resin liquid is produced.

Then, the green fluorescent material-containing resin liquid(fluorescent material-containing resin liquid) is introduced into thechamber 103 of the ink jet printer head 100 shown in FIG. 1, and thendischarged via the nozzle 101 so as to be applied onto the sphericalsurface of the light-transmissive silicone resin layer 6. That is, thegreen fluorescent material-containing resin liquid is applied onto thespherical surface of the light-transmissive silicone resin layer 6 bythe ink jet printing method.

Note however that the green fluorescent material-containing resin liquidis not applied entirely to the spherical surface of thelight-transmissive silicone resin layer 6. Instead, the greenfluorescent material-containing resin liquid is applied in dots on thespherical surface of the light-transmissive silicone resin layer 6.Specifically, when being viewed downwardly in a direction orthogonal tothe first surface 2 of the substrate 1, the green fluorescentmaterial-containing resin liquid is applied in 9 circular dots eachhaving a diameter of 0.5 mm and provided at an interval of 0.34 mm.

Subsequently, the green fluorescent material-containing resin liquid iscured at 150° C. for 1 hour, so that the color-adjusting fluorescentlayer 7 is formed. As shown in FIG. 2, the color-adjusting fluorescentlayer 7 is formed in 9 circular dots each having the diameter of 0.5 mmand provided at the interval of 0.34 mm.

The subsequent step measures, with the use of the measurement apparatusas described above and in the same way as described above, a colorproperty of light that is emitted from the light-emitting apparatus thusincluding the color-adjusting fluorescent layer 7 (step S 17). By thismeasurement, it is confirmed that the color property of light is withinthe color region (b). By above processes, the color property of lightemitted from the light-emitting apparatus categorized in the color group(a1) is adjusted, so that it is possible to obtain the light-emittingapparatus that is categorized in the color group (b).

At last, the unit including the group of plural light-emittingapparatuses is separated into each individual light-emitting apparatus(step S 18). Separation of the light-emitting apparatuses can be carriedout by a method that downwardly cuts the substrate 1, by a cutter 131from that side of the substrate 1 on which the light-transmissivesilicone resin layer 6 has been formed, above a separation groove on thesecond surface of the substrate 1. According to the method, thelight-transmissive silicone resin layer 6 is cut by the cutter 131, andthe substrate 1 is broken along the separation groove. Therefore, it ispossible to easily separate, into each individual light-emittingapparatus, the light-emitting apparatuses formed in the unit.

By above processes, it is possible to manufacture the light-emittingapparatus 10 individually separated. Because the light-emittingapparatus 10 manufactured in this way has been subjected to the coloradjustment so that light to be emitted from the light-emitting apparatus10 has the target color, the light-emitting apparatus 10 can emit lightthat is free from the color shift and that has the target color.Further, it is possible to suppress variation in color of the lightemitted from the light-emitting apparatus 10, without causing adeterioration in brightness of the light. Thus, a yield rate can beimproved.

As described so far, the light-emitting apparatus 10 of the presentembodiment is configured so that the color-adjusting fluorescent layer7, which contains the second particulate fluorescent material, is formedin dots in a layer provided on an outer side in the emission directionwith respect to the fluorescent material-containing layer 5 whichcontains the first particulate fluorescent material.

That is, the light-emitting apparatus 10 is manufactured by the methodthat includes the steps of: (i) forming the fluorescentmaterial-containing layer 5 on the first surface 2 of the substrate 1 sothat the LED chips 3 mounted on the first surface 2 of the substrate 1are covered by the fluorescent material-containing layer 5 (step S 13shown in FIG. 4); (ii) measuring, after the step (i), the color propertyof the light that is emitted from the LED chips 3 via the fluorescentmaterial-containing layer 5 (step S 15 shown in FIG. 4); and (iii)forming, based on the color property measured in the step (ii), thecolor-adjusting fluorescent layer 7 in dots in the layer provided on anouter side of the fluorescent material-containing layer 5 in theemission direction (step S 16 shown in FIG. 4).

Accordingly, the color-adjusting fluorescent layer 7 is formed in dots.Therefore, it is possible to carry out fine color adjustment so that thelight emitted from the light-emitting apparatus 10 has the targetedcolor. In consideration of the above, it is possible to prevent a subtlecolor shift that occurs due to a factor such as a difference in densityof the fluorescent material. Further, this makes it possible tomanufacture the light-emitting apparatus 10 at a good yield rate and areduced cost.

Additionally, because the color-adjusting fluorescent layer 7 is formedin dots instead of being formed so as to entirely cover thelight-transmissive silicone resin layer 6, it is possible to reduce anapplication amount of the second particulate fluorescent material to aslight amount. Thus, it is possible to prevent a deterioration in alight beam that occurs due to the second particulate fluorescentmaterial having been applied.

(Color Dependency on Emission Angle)

What should be considered in a case where the color-adjustingfluorescent layer 7 is formed in dots is that there is a potential riskthat a color distribution of light may be varied, depending on adirection in which the light is emitted. In consideration of this, it isconfigured such that the light-emitting apparatus 10 of the presentembodiment includes four LED chips 3 and the fluorescentmaterial-containing layer 5 that also functions as an optical diffusionlayer, so that a color difference of light is less likely to occurregardless of a direction in which light is emitted. This enlarges aneffective size of a light source.

The fluorescent material-containing layer 5 functions primarily tochange the color of the light to white, and the color-adjustingfluorescent layer 7 formed in dots functions solely to carry out thefine color adjustment to the color of the light. Note that if thelight-emitting apparatus 10 is used in a situation where a property oflight which depends on an emission angle is of a particular concern, itis preferable that the color-adjusting fluorescent layer 7 be formed indots which are smaller in diameter but increased in number.

(Spectrum Property)

FIG. 6 is a graph showing (i) a spectrum of light emitted from thelight-emitting apparatus 10 that includes no color-adjusting fluorescentlayer 7 (in FIG. 6, this is described as “before application of coloradjusting fluorescent material”), and (ii) a spectrum of light emittedfrom the light-emitting apparatus 10 that includes the color-adjustingfluorescent layer 7 (in FIG. 6, this is described as “after applicationof color adjusting fluorescent material”). In the graph, a wavelength(nm) is shown in the horizontal axis, and a light intensity (relativelight intensity) is shown in the vertical axis. The graph shows thespectra each measured in a front direction of the light-emittingapparatus 10.

From FIG. 6, it is clear that blue light is decreased in light intensityafter the color-adjusting fluorescent layer 7 has been formed. However,light as a whole is decreased in brightness by merely 2.4% to 3.3%,because (i) a visibility of the blue light is not so high, and (ii)green light, whose visibility is high, has not been decreased in lightintensity.

Another Modified Example

Above description of the light-emitting apparatus 10 deals with a casein which the light-emitting apparatus categorized in the color group(a1) is subjected to the fine color adjustment, so that thelight-emitting apparatus categorized in the color group (a1) isre-categorized in the color group (b). Note, however, that fine coloradjustment can be carried out to a light-emitting apparatus that iscategorized in the color group (a2) or the color group (a3).

For example, in a light-emitting apparatus categorized in the colorgroup (a2), a color-adjusting fluorescent layer 7 is formed in 18 dotsso that the light-emitting apparatus will be re-categorized in the colorgroup (b). FIG. 7( a) is a view showing a light-emitting apparatus 10 ain which the color-adjusting fluorescent layer 7 is formed in 18 dots.

On the other hand, in a light-emitting apparatus categorized in thecolor group (a3), a color-adjusting fluorescent layer 7 is formed in 27dots so that the light-emitting apparatus will be re-categorized in thecolor group (b). FIG. 7( b) is a view showing a light-emitting apparatus10 b in which a color-adjusting fluorescent layer 7 is formed in 27dots. As seen in the above, a color-adjusting fluorescent layer 7 isformed in more dots in a light-emitting apparatus which emits lighthaving a greater color shift.

Note that no color adjustment requires to be carried out in alight-emitting apparatus categorized in the color group (b). Thus, afterthe step S 15 in which a color property is measured, the steps S 16 andS 17 can be skipped, and a process should be advanced into the step S 18in which a separation step is carried out. In this case, no coloradjusting fluorescent layer 7 is formed in the light-emitting apparatus.

In the light-emitting apparatus 10 described earlier, thecolor-adjusting fluorescent layer 7 is formed in dots in accordance withthe ink jet printing method. However, the present invention is notlimited to this. A method such as a dispenser method, a transfer method,or a printing method can be used as long as selective (local)application of a fluorescent material-containing liquid can be carriedout.

Second Embodiment

Another embodiment of the present technology is described as follows,with reference to the drawings. Note that the present embodiment is thesame as First Embodiment described earlier except a configurationdescribed hereinafter. Note also that for convenience, members operatingin the same ways as those shown in the drawings dealt with in FirstEmbodiment are given the same reference numerals, and explanationsthereof are omitted.

In the light-emitting apparatus 10 of First Embodiment describedearlier, the color-adjusting fluorescent layer 7 is formed through stepsof: mixing the second particulate fluorescent material directly with thefluid resin so as to produce the particulate fluorescentmaterial-containing resin liquid; and applying, by the ink jet printingmethod, the particulate fluorescent material-containing resin liquid indots on the spherical surface of the light-transmissive silicone resinlayer 6.

In the present embodiment, on the other hand, a color-adjustingfluorescent layer 7 contains a fluorescent material-containing resinpowder whose particles are made from a second particulate fluorescentmaterial temporarily coated with a resin being in a solid state. Thefluorescent material-containing resin powder is mixed with a fluid resinsuch that a resin liquid which contains the fluorescentmaterial-containing resin powder is produced. Then, the resin liquid isapplied in dots on a spherical surface of a light-transmissive siliconeresin layer 6 by the ink jet printing method.

(Method for Producing Fluorescent Material-Containing Resin Powder)

The following describes a method for producing a fluorescentmaterial-containing resin powder.

First, a fluid resin is prepared as a material for a resin in thefluorescent material-containing resin powder. Then, the secondparticulate fluorescent material is added into the fluid resin, so thata mixture of the second particulate fluorescent material and the fluidresin produces a fluorescent material-mixed resin liquid. Note that in apresent example, the fluorescent material to be added into the fluidresin is limited to one kind. After this, the fluorescent material-mixedresin liquid is solidified, and then powdered by an apparatus such as acutting machine so that the fluorescent material-containing resin powderis produced.

Note that a method for mixing the second particulate fluorescentmaterial with the fluid resin so as to produce the fluorescentmaterial-containing resin powder, is not particularly limited. However,it is preferable that the method uses a rotation/revolution mixer. (i)The number of rotation and revolution and (ii) a length of arotation/revolution time of the rotation/revolution mixer can be set asappropriate based on a combination of the second particulate fluorescentmaterial and the fluid resin.

Note also that a method for producing the fluorescentmaterial-containing resin powder from the fluorescent material-mixedresin having been subjected to hardening, can be a commonly-used methodsuch as a ball mill method or a jet mill method. In such a method asdescribed above, a powdering step can produce the fluorescentmaterial-containing resin powder that has, for example, a sphericalshape or an oval shape.

It is preferable that the number of particles of the second fluorescentmaterial to be contained in one particle of the fluorescentmaterial-containing resin powder be 1 to 3. This is because if 4 or moreparticles of the second fluorescent material are contained in oneparticle of the fluorescent material-containing resin powder, theparticle of the fluorescent material-containing resin powder isincreased in size, and the nozzle 101 of the ink jet printer head 100shown in FIG. 1 may be clogged with the fluorescent material-containingresin powder.

The following deals with one example of processing of the fluorescentmaterial-containing resin powder, by describing a concrete example.

First, a silicone resin was heated to be fluid so that it could be usedas a material for a fluid resin. Then, a green fluorescent material(Si.Al)₆(O.N)₈:Eu, which was a second particulate fluorescent material,was added into and mixed with the fluid resin made of the siliconeresin, so that a fluorescent material-mixed resin liquid was produced.In this case, a mass mixing ratio of the green fluorescent material tothe silicone resin in the fluorescent material-mixed resin liquid was1:4.

For mixing the silicone resin with the green fluorescent material, therotation/revolution mixer was used. In the present example, the siliconeresin and the green fluorescent material were mixed with each other at afrequency of 2000/min for a rotation/revolution time of 3 minutes.

After this, the fluorescent material-mixed resin liquid subjected to themixture was kept at 100° C. for 1 hour so as to be pre-cured.Subsequently, the fluorescent material-mixed resin liquid was kept at150° C. for 5 hours so as to be cured, so that a fluorescentmaterial-mixed resin was produced. The fluorescent material-mixed resinwas powdered by a cutting machine in accordance with the ball millmethod. By above processes, the fluorescent material-containing resinpowder was produced.

Note that it is desirable that the fluorescent material-containing resinpowder meet the following three conditions, in order that a dischargedefect of an ink jet apparatus be prevented and wearing-off of thenozzle 101 be reduced:

-   (1) a particle of the fluorescent material-containing resin powder    has a small diameter of, for example, 50 μm or smaller and    preferably 20 μm or smaller;-   (2) a particle of the fluorescent material-containing resin powder    has a narrow diameter distribution-   (3) a particle of the fluorescent material-containing resin powder    has a shape with no corner, such as a spherical shape or an oval    shape.

FIG. 8 is a view schematically showing the ink jet printer head 100 viawhich a coating liquid 23 of a color-adjusting fluorescent material isapplied. As shown in FIG. 8, (i) a green fluorescent material-containingresin powder 21 that was produced in the above-described way and (ii) afluid light-transmissive silicone resin 22 were introduced into a tank(chamber 103 in which a fluorescent material-containing resin isintroduced), such that the coating liquid 23 (a mixture of the greenfluorescent material-containing resin powder 21 and the fluidlight-transmissive silicone resin 22) was to be discharged from thenozzle 101.

FIG. 9 is an enlarged cross sectional view showing the color-adjustingfluorescent layer 7 that was formed by solidifying the coating liquid23. (i) That resin included in the green fluorescent material-containingresin powder 21 which coated the second particulate fluorescent materialand (ii) a resin that coated the color-adjusting fluorescent layer 7were a same silicone resin. However, these silicone resins have beencured at different timings. Thus, close observation allows an observerto see a boundary, as shown in FIG. 9, between the silicone resins.

In the present example, a first particulate fluorescent material in thefluorescent material-containing layer 5 for covering the LED chips 3 wasa red fluorescent material K₂TiF₆:M and the green fluorescent material(Si.Al)₆(O.N)₈:Eu. Also, in the present example, the second particulatefluorescent material in the resin powder 21 was the green fluorescentmaterial (Si.Al)₆(O.N)₈:Eu.

Generally, the particulate fluorescent material, which had a relativegravity larger than the fluid resin, easily settled out in the fluidresin. Thus, a fluorescent material concentration easily became unevenin the fluid resin contained in a tank (chamber 103) of the ink jetapparatus.

On the other hand, a method using the resin powder of the presentexample made it possible that a fluorescent material concentration becloser to be uniform in a fluid resin in a tank, because the resinpowder of the present example, which had been formed from theparticulate fluorescent material temporarily coated with the resin, hada relative gravity close to that of the fluid resin. Thus, it waspossible to improve an accuracy of color adjustment to be carried out bythe ink jet printing method.

Also, because the resin powder was formed from the particulatefluorescent material temporarily coated with the resin, aggregation ofparticles of the resin powder could be reduced. Thus, it was possible toprevent the clogging of the nozzle 101 that occurred in discharging ofthe coating liquid 23 of the color-adjusting fluorescent material. As aresult, the coating liquid 23 could be smoothly discharged.

Further, it could be easily configured such that the particles of theresin powder of the present example have an equal size. Thus, by use ofthe resin powder having an equal particle size, it was possible toperform application of the fluorescent material with highcontrollability. In addition, by forming the resin powder in a shapewith no corners, e.g., a spherical shape, it was possible to reduce thewearing-off of the nozzle 101. By coating, with a resin, a particulatefluorescent material (in particular, β sialon) that had a crystalstructure of a nonspherical shape, it was possible to highly effectivelyreduce the wearing-off of the nozzle 101.

Third Embodiment

Another embodiment of the present technology is described as follows,with reference to the drawings. Note that the present embodiment is thesame as First and Second Embodiments described earlier, except aconfiguration described hereinafter. Also, note that members operatingin the same ways as those shown in the drawings dealt with in First orSecond Embodiment are given the same reference numerals, andexplanations thereof are omitted.

(Configuration of Light-Emitting Apparatus)

FIG. 10 is a top view showing one example of a configuration of alight-emitting apparatus 30 in accordance with the present embodiment.

The light-emitting apparatus 30 of the present embodiment is the same asthe light-emitting apparatus 10 of First Embodiment except in that thelight-emitting apparatus 30 of the present embodiment includes nolight-transmissive silicone resin layer 6. That is, the light-emittingapparatus 30 is configured such that a color-adjusting fluorescent layer7 partially covers a top surface of a fluorescent material-containinglayer 5. In other words, the color-adjusting fluorescent layer 7 isformed in dots.

By forming the color-adjusting fluorescent layer 7 so as to partiallycover the fluorescent material-containing layer 5, as described above,it is possible to manufacture the light-emitting apparatus 30 in whichpartial adjustment to the fluorescent material-containing layer 5 alonecan provide a desired color property of light. As described later, itpossible, for example, that a light-emitting apparatus 30 which provideslight of the color range (b) in color coordinates shown in FIG. 14 bemanufactured.

In the light-emitting device 30, a substrate 1 includes a firstelectrode 31 and a second electrode 32 each being connectable to anexternal circuit. It is preferable that the fluorescentmaterial-containing layer 5 have a cross section having a hexagonalshape, a circular shape, a rectangular shape, or a square shape. Thefluorescent material-containing layer 5 has a rectangular shape whenviewed from above. For example, the fluorescent material-containinglayer 5 has the rectangular shape with a long side P of 13 mm and ashort side Q of 10 mm. In the light-emitting device 30, the top surfaceof the fluorescent material-containing layer 5 serves as an emissionsurface.

(Method for Manufacturing Light-Emitting Apparatus)

Next, the following describes a method for manufacturing thelight-emitting apparatus 30 including the configuration described above.

FIGS. 12( a) through 12(e) are views each showing a step of the methodfor manufacturing the light-emitting apparatus 30. FIG. 13 is a flowchart showing steps of the method that includes a color adjustment stepto be performed in the light-emitting apparatus 30.

First, on a first surface 2 of the substrate 1, four linear wiringpatterns 33 a through 33 d are formed as shown in FIG. 12( a). Thewiring patterns 33 a through 33 d are provided in parallel with eachother. A concrete example of a method for forming the wiring patterns 33a through 33 d is suitably a method that includes the steps of (i)forming a metal film having a thickness of 0.07 mm onto a first surface2 of a substrate 1 by spattering, which substrate 1 is a white-colorsubstrate made from aluminum oxide having a thickness of 1 mm, and (ii)forming wiring patterns 33 a through 33 d (width of 1 mm, interval of 2mm) by photo etching. Note however that the present invention is notlimited to this.

Subsequently, LED chips 3 are mounted in respective intervals in thewiring patterns 33 a through 33 d (step S 21). Mounting of the LED chips3 can be carried out by attaching the LED chips 3 directly to thesubstrate 1 by use of a thermosetting resin such as, for example, anepoxy resin, an acrylic resin, or an imide resin. With the method, it ispossible that a withstand voltage, which is determined based on acreeping discharge voltage, be increased as much as possible.

That is, a withstand voltage between one of the LED chips 3 aligned inan electrode direction and another of the LED chips 3 aligned in theelectrode direction is determined based on (i) a distance between theseLED chips 3 and (ii) a permittivity of the substrate 1. Also, awithstand voltage between one of the LED chips 3 and a correspondingelectrode is determined in a similar way, based on a shortest distancebetween the one of the LED chips 3 and the electrode (wiring patterns 33a through 33 d) as well as the permittivity of the substrate 1.

In consideration of the above, a preferable concrete example can be aconfiguration in which LED chips (each having a width of 0.24 mm, alength of 0.48 mm, and a thickness of 0.14 mm) to serve as the LED chips3 are fixedly attached, via an epoxy resin, in respective intervals ofthe wiring patterns 33 a through 33 d each having a linear shape andformed in parallel with one another on the substrate 1. However, thepresent invention is not limited to this.

Then, wire-bonding is carried out by use of the wires 4 (step S 22). Inthe wire-bonding, as shown in FIG. 12( b), the wiring patterns 33 athrough 33 d are electrically connected to the respective LED chips 3 bythe wires 4, based on a desired electrical conduction state.

Note that it is preferable that the method for manufacturing thelight-emitting apparatus 30 further include the following steps afterelectrically connecting the LED chips 3 to the respective wiringpatterns 33 a through 33 d in the above-described way: (i) checking acharacteristic of each of the LED chips 3, and (ii), in a case where acharacteristic defect is detected by the step (i), electricallyconnecting a spare LED chip 3 to corresponding ones of the wiringpatterns 33 a through 33 d.

The step (i) can be carried out by, for example, supplying a current tothe LED chips 3 and measure optical output characteristics of therespective LED chips 3. Optionally, the step (i) can be carried outconcurrently with a visual inspection in which disconnection of a wire 4and a bonding defect are checked.

Subsequently, a resin in which the fluorescent particle is contained isapplied, which resin later forms the fluorescent material-containinglayer 5 (step S 23). Specifically, the silicone rubber seat 113 isattached onto the first surface 2 of the substrate 1 at first, as shownin FIG. 12( c). The silicone rubber seat 113 has a through-hole 114 forproviding a space for forming a sealing member. The through-hole 114 isnot particularly limited in shape, and the through-hole 114 can have ashape which is determined based on a cross sectional shape of thesealing member to be formed.

As described earlier, it is preferable that the fluorescentmaterial-containing layer 5 have a cross section of a hexagonal shape, acircular shape, a rectangular shape, or a square shape. In considerationof this, it is preferable that the silicone rubber seat 113 have thethrough-hole 114 of a hexagonal shape, a circular shape, a rectangularshape, or a square shape.

The silicone rubber seat 113, which is easily available, is made fromrubber and has an elasticity. Thus, it is possible to firmly attach thesilicone rubber seat 113 even to a bump, such as the wiring pattern,without leaving any space. Further, the silicone rubber seat 113 canprevent a leakage of the fluorescent material-containing resin which isto be described later. Additionally, because the silicone rubber seat113 can be easily removed after the sealing member is formed, it ispreferable to apply a two-sided adhesive sheet entirely on a surface ofthe silicone rubber seat 113 and attach the silicone rubber seat 113 tothe substrate 1 via the two-sided adhesive sheet.

As shown in FIG. 12( d), after the silicone rubber seat 113 has beenattached onto the substrate 1, the through-hole 114 is filled with thefluorescent material-containing resin that serves to seal the LED chips3, and then, the fluorescent material-containing resin in thethrough-hole 114 is cured so as to form the fluorescentmaterial-containing layer 5.

A subsequent step of the method measures a color property of light thatis emitted from the light-emitting apparatus thus including thefluorescent material-containing layer 5 (step S 24). The color propertyof light can be measured with a measurement apparatus that adopts a d/8(diffusion illumination 8° light receiving system) optical systemconforming to the condition C of JIS 28722, DIN 5033 teil 7, ISOk772411.

FIG. 14 is a graph showing CIE color coordinates. For example, there isa case where the previous step (step S 23) has formed the fluorescentmaterial-containing layer 5 in the following process so that thelight-emitting apparatus will emit light of the color region (a1) havingcolor coordinates (x, y)=(0.333, 0.338). The process in this caseincludes the steps of (i) pouring, into the through-hole 114 in thesilicone rubber seat 113, the fluorescent particle-containing resin thathas been produced by mixing the first particulate fluorescent material(red fluorescent material CaAlSiN₃:Eu and green fluorescent material(Si.Al)₆(O.N)₈:Eu)) with the silicone resin to serve as the fluid resin,at a weight ratio of 5:100, and (ii) thermally curing the fluorescentparticle-containing resin thus poured, at 150° C. for 30 minutes. Insuch a case, light emitted from the light-emitting apparatus will be ofone of color groups of the color regions (b), (a1), and (a2) shown inFIG. 14.

In the light-emitting apparatus that is categorized into the color groupcorresponding to the color region (a1) or the color region (a2), thecolor-adjusting fluorescent layer 7 is formed on a first surface (topsurface, emission surface) of the fluorescent material-containing layer5 so that the light will have a color of the color region (b). That is,a resin liquid (fluorescent material-containing liquid) containing thesecond particulate fluorescent material is applied onto the top surfaceof the fluorescent material-containing layer 5 (step S 25), which resinliquid later forms the color-adjusting fluorescent layer 7.

The second particulate fluorescent material and the resin liquid forconstituting the color-adjusting fluorescent layer 7 can be selectedfrom the first particulate fluorescent material and the resin liquid forconstituting the fluorescent material-containing layer 5, as appropriatebased on a desired color property. In some cases, the second particulatefluorescent material and the resin liquid for constituting thecolor-adjusting fluorescent layer 7 can be selected from the firstparticulate fluorescent material and the resin liquid for constitutingthe fluorescent material-containing layer 5, into which an opticaldiffusing agent is added.

In the example described earlier, the light-emitting apparatus wasconfigured as follows so that it was possible to obtain light of thecolor region (b) which had color coordinates (x, y)=(0.345, 0.350) inthe CIE color coordinates. The second particulate fluorescent materialwas, for example, the green fluorescent material (Si.Al)₆(O.N)₈:Eu, andthe resin liquid was, for example, the fluid silicone resin. The secondparticulate fluorescent material and the resin liquid were mixed witheach other at a weight ratio of 2:100 so that the fluorescentmaterial-containing liquid was produced. Then, the fluorescentmaterial-containing liquid was applied onto the fluorescentmaterial-containing layer 5 by the ink jet printing method.

The fluorescent material-containing liquid was applied in circular dotseach having a diameter of 0.5 mm and provided at an interval of 0.34 mm.Into a light-emitting apparatus categorized in the color group (a1), thefluorescent material-containing liquid was applied in 21 dots. On theother hand, into a light-emitting apparatus categorized in the colorgroup (a2), the fluorescent material-containing liquid was applied in 42dots. As seen in the above, the fluorescent material-containing liquidwas applied in more dots in a light-emitting apparatuses which emitslight having a greater color shift.

After the above, (i) the fluorescent material-containing liquid wascured at 150° C. for 1 hour, and then, (ii) the silicone rubber sheet113 was removed, so that the color-adjusting fluorescent layer 7 wasformed as shown in FIG. 12( e). FIG. 10 is a view showing thelight-emitting apparatus 30 including the color-adjusting fluorescentlayer 7 that had been formed in 21 dots. On the other hand, FIG. 11 is aview showing the light-emitting apparatus 30 a including thecolor-adjusting fluorescent layer 7 that had been formed in 42 dots. Asseen in the above, the color-adjusting fluorescent layer 7 was formed inmore dots in a light-emitting apparatus which emits light having agreater color shift.

A subsequent step of the method measured, by use of the measurementapparatus as described above and in the same way as described above, acolor property of light emitted from the light-emitting apparatus thusincluding the color-adjusting fluorescent layer 7 (step S 26). By thismeasurement, it was confirmed that a color property of the light was inthe color region (b). By above processes, it was possible to manufacturethe light-emitting apparatus 30 that emits light of the color group (b).

At last, separation into individual light-emitting apparatuses wascarried out (step S 27). This allowed manufacturing of thelight-emitting apparatus 30 thus separated into an individual apparatus.As described so far, by forming the color-adjusting fluorescent layer 7in dots whose number is changed based on a color shift, it is possibleto manufacture the light-emitting apparatus 30 in which light has nocolor shift, at a good yield rate and a reduced cost.

Fourth Embodiment

Another embodiment of the present technology is described as follows,with reference to the drawings. Note that the present embodiment is thesame as First through Third Embodiments described earlier except aconfiguration described hereinafter. Note also that members operating inthe same ways as those shown in the drawings dealt with in any of Firstthrough Third Embodiments are given the same reference numerals, andexplanations thereof are omitted.

(Configuration of Light-Emitting Apparatus)

FIG. 15 is a cross sectional view showing one example of a configurationof a light-emitting apparatus 40 in accordance with the presentembodiment. FIG. 16 is a top view showing the light-emitting apparatus40 shown in FIG. 15.

The light-emitting apparatus 40 of the present embodiment is asurface-mounting light-emitting apparatus which outwardly emits lightand in which a fluorescent material is uniformly dispersed in alight-transmissive resin. As shown in FIGS. 15 and 16, thelight-emitting apparatus 40 includes (i) an insulating substrate 41 madefrom polyphthalamide (PPA), (ii) LED chips 3, (iii) wires 4, (iv) aprotective element 43 made from an Si zener diode, (v) a layercontaining the fluorescent material, and (vi) a color-adjustingfluorescent layer 7.

A light reflecting wall 42 is provided above the insulating substrate41, which light reflecting wall 42 has a recess opening recesseddownwardly from a top surface serving as an emission surface of thelight-emitting apparatus 40. The insulating substrate 41 has arectangular shape when viewed from above, and has a length S of, forexample, 3.2 mm and a width R of 2.8 mm.

On the insulating substrate 41, a first electrode 45 and a secondelectrode 46 are formed on a bottom surface (i.e., a top surface of theinsulating substrate 41) of the recess opening. Each of the firstelectrode 45 and the second electrode 46 is connected to an externalelectrode (which is not illustrated) so as to be able to be electricallyconnected to a power supply provided outside of the light-emittingapparatus 40.

On the first electrode 45, a LED chip 3 is provided and attached to thefirst electrode 45 via a silicone resin. On the second electrode 46, aprotective element 43 is provided and attached to the second electrode46 via a silver paste. The LED chip 3 has two electrodes, one of whichis connected to the first electrode 45 via a wire 4 made of gold and theother of which is connected to the second electrode 46 via a wire 4 madeof gold.

The protective element 43 has one electrode connected to the firstelectrode 45 via a wire 4, and the other electrode connected to thesecond electrode 46 via a silver paste. That is, the protective element43 is connected to the first electrode 45 and the second electrode 46 inparallel with the LED chip 3.

Both the LED chip 3 and the protective element 43 are sealed by afluorescent material-containing layer 44, which fills the recess openingin the insulation substrate 41. The fluorescent material-containinglayer 44 contains a green fluorescent material and a red fluorescentmaterial (each being a first fluorescent material), each of whichabsorbs blue light emitted from the LED chip 3 and emits fluorescentlight. As such, light to be emitted from the light-emitting apparatus 40has a white color. On the fluorescent material-containing layer 44serving as the emission surface, the color-adjusting fluorescent layer 7is formed.

(Manufacturing of Light-Emitting Apparatus)

Next, the following describes a method for manufacturing thelight-emitting apparatus 40 having the configuration described earlier.Note that the method is explained, following a flow chart of FIG. 13,because the light-emitting apparatus 40 can be manufactured followingthe steps in the flow chart.

First, the LED chip 3 is mounted on the first electrode 45 that has beenformed in a bottom surface of the recess opening in the insulatingsubstrate 41, and the LED chip 3 is attached to the first electrode 45via a silicone resin (step S 21). Then, a protective element 43 ismounted on the second electrode 46 having been formed in the bottomsurface of the recess opening in the insulating substrate 41. Theprotective element 43 includes two electrodes, one of which iselectrically connected to the second electrode 46 via a silver paste andfixed to the second electrode 46.

Subsequently, one of two electrodes of the LED chip 3 is connected tothe first electrode 45 via a wire 4 made of gold, and the other one ofthe two electrodes of the LED chip 3 is connected to the secondelectrode 46 via a wire made of gold (step S 22). Also, the other one ofthe electrodes of the protective element 43 is electrically connected tothe first electrode 45 via a wire 4 made of gold.

After the above, a silicone resin that contains a fluorescent materialis introduced into the recess opening in the insulating substrate 41,and then kept at 150° C. for 3 hours so as to be cured (step S 23). Thisforms the fluorescent material-containing layer 44. This fluorescentmaterial-containing layer 44 uniformly contains the fluorescent materialin the silicone resin that is light-transmissive.

Note that the fluorescent material-containing layer 44 is obtained bymixing (i) the silicone resin that is light-transmissive with (ii) afirst particulate fluorescent material made of a red fluorescentmaterial CaAlSiN₃:Eu and a green fluorescent material (Si.Al)₆(O.N)₈:Eu.Here, a weight ratio of the first particulate fluorescent material tothe silicone resin is 0.173.

The step following the step S 23 measures a color property of lightemitted from the light-emitting apparatus which now includes thefluorescent material-containing layer 44 (step S 24). The color propertyof light emitted from the light-emitting apparatus can be measured by ameasurement apparatus which adopts a d/8 (diffusion illumination 8°light receiving system) optical system conforming to the condition C ofJIS 28722, DIN 5033 teil 7, ISOk772411.

For example, there is a case where, in the previous step (step S 23),the fluorescent material-containing layer 44 has been formed in thefollowing process so that the fluorescent material-containing layer 44will emit light of the color region (a2) which has coordinates (x,y)=(0.320, 0.330) in the CIE color coordinates shown in FIG. 14. Theprocess in this case includes the steps of: introducing a mixtureobtained by mixing the first particulate fluorescent material with thesilicone resin serving as the fluid resin, at a weight ratio of 5:100;and curing the mixture at 150° C. for 30 minutes. In such a case, thelight-emitting apparatus thus including the fluorescentmaterial-containing layer 44 emits light of any one of the color regions(b), (a1), and (a2) shown in FIG. 14.

The light-emitting apparatus is categorized into one of color groups,based on the measurement of the light that is emitted from thelight-emitting apparatus. Into the light-emitting apparatus which iscategorized into the color group (a1) or (a2), the color-adjustingfluorescent layer 7 is formed on a surface (top surface) of thefluorescent material-containing layer 44 that serves as the emissionsurface, so that that the light emitted from the light-emittingapparatus will have a color property of the color region (b). That is, aresin liquid that contains the second particulate fluorescent materialis applied onto the top surface of the fluorescent material-containinglayer 44 (step S 25), which resin liquid later constitutes thecolor-adjusting fluorescent layer 7.

In the above case, in order that the light-emitting apparatus can emitlight of the color region (b) having coordinates (x, y)=(0.345, 0.350)in the CIE color coordinates, a green fluorescent material, for example,is mixed with the silicone resin at a weight ratio of 2:100 so that aliquid containing the fluorescent material is produced. Then, the liquidis applied onto the fluorescent material-containing layer 44 by the inkjet printing method.

In the light-emitting apparatus categorized into the color group (a2),the liquid containing the fluorescent material is applied in 30 circulardots each having a diameter of 0.5 mm and provided at an interval of0.34 mm. One the other hand, in the light-emitting apparatus categorizedinto the color group (a1), the liquid containing the fluorescentmaterial is applied in 30 circular dots each having a diameter of 0.35mm and provided at an interval of 0.34 mm. As seen in the above, theliquid containing the fluorescent material is applied in more dots in alight-emitting apparatus which emits light having a greater color shift.

Subsequently, the liquid containing the fluorescent material is cured at150° C. for 1 hour, so that the color-adjusting fluorescent layer 7 isformed. A subsequent step measures, by use of the above-describedmeasurement apparatus and in the same way as described above, a colorproperty of light emitted from the light-emitting apparatus thusincluding the color-adjusting fluorescent layer 7 (step S 26). By this,it is confirmed that the light emitted from the light-emitting apparatusincluding the color-adjusting fluorescent layer 7 has the color of thecolor region (b). By the above processes, it is possible to manufacturelight-emitting apparatuses 40 each being categorized into the colorgroup (b). At last, the light-emitting apparatuses 40 are separated intoindividual light-emitting apparatuses (step S 27). By this, it ispossible to manufacture a light-emitting apparatus 40 thus separatedinto an individual light-emitting apparatus.

As seen in the above, the light-emitting apparatus 40 includes thecolor-adjusting fluorescent layer 7 that has been formed in dots whosediameter is varied based on a color shift. Thus, it is possible tomanufacture, at a good yield rate and a reduced cost, the light-emittingapparatus 40 that emits light having no color shift.

Note that the light-transmissive resin (light-transmissive member) forconstituting the fluorescent material-containing layer 44 can be alight-transmissive resin having a good weather-resistance, such as anepoxy resin, a urea resin, a silicone resin, a modified epoxy resin, amodified silicone rein, or polyamide. Alternatively, in a case where thelight-reflecting wall 42 is made from a material, such as AIN orceramic, having a resistance to a high temperature, thelight-transmissive member for constituting the fluorescentmaterial-containing layer 44 can be a light-transmissive member such asa glass, instead of the light-transmissive resin.

Fifth Embodiment

Another embodiment of the present technology is described as follows,with reference to the drawings. Note that the present embodiment is thesame as First through Fourth Embodiments described earlier, except aconfiguration described hereinafter. Note also that for convenience,members operating in the same ways as those shown in the drawings dealtwith in any of First through Fourth Embodiments are given the samereference numerals, and explanations thereof are omitted.

FIG. 17 is a cross sectional view showing one example of a configurationof a light-emitting apparatus 50 in accordance with the presentembodiment. Note that, when being viewed from above, the light-emittingapparatus 50 shown in FIG. 17 has the same appearance as thelight-emitting apparatus 40 shown in FIG. 16.

As shown in FIG. 17, the light-emitting apparatus 50 (fluorescentmaterial settling-type light-emitting apparatus) of the presentembodiment has the same configuration as the light-emitting apparatus 40of Fourth Embodiment except in that the light-emitting apparatus 50 ofthe present embodiment includes (i) no fluorescent material-containinglayer 44, (ii) a fluorescent material-containing layer 51, and (iii) alayer 52 having a less fluorescent material (less-fluorescent-materialcontaining layer 52).

Note that the less-fluorescent-material containing layer 52 is a layercontaining the fluorescent material by an amount of ½ or less of anamount of a fluorescent material contained in the fluorescentmaterial-containing layer 44.

As the color adjusting method, there is proposed a method in whichremoval of the fluorescent layer is carried out by directly performing,to the fluorescent layer, (i) cutting, (ii) grinding, or (iii)mechanical treatment. However, such a method may have a problem in thatthe fluorescent layer leaves a residue or is blacked when thefluorescent layer is removed by performing, directly to the fluorescentlayer, (i) cutting, (ii) grinding, or (iii) mechanical treating.

In contrast, in the present embodiment in which the color-adjustingfluorescent layer 7 is formed in dots, it is possible to carry out coloradjustment having a higher accuracy but causing no such problem causedin removal of the fluorescent material. The light-emitting apparatus 50in which the fluorescent material settles out near the LED chip 3provides the same effect.

(Others)

In the descriptions provided earlier, the method for applying the resinliquid containing the fluorescent material, which resin liquidconstitutes the color-adjusting fluorescent layer 7, can be the ink jetprinting method. Alternatively, for example, the method can be a methodin which the resin liquid is manually applied onto a tip of a needle,and then the resin liquid thus applied onto the tip of a needle isapplied onto the surface of the light-emitting apparatus. In the abovecase in which the resin liquid is applied in dots, it is possible toadjust the color adjustment by changing the number of dots. Thus, it ispossible to carry out a certain level of color adjustment even in a casewhere the application of the resin liquid is performed manually with apoor controllability.

It is described earlier that in the color-adjusting fluorescent layer 7,the green fluorescent material is contained. Alternatively, it can beconfigured such that in the color-adjusting fluorescent layer, a mixtureof a green fluorescent material and a red fluorescent material arecontained, or such that the color-adjusting fluorescent layer includescolor-adjusting fluorescent layers formed separately, one of whichcolor-adjusting fluorescent layers is formed by applying a resin liquidcontaining a green fluorescent material, and the other of whichcolor-adjusting fluorescent layers is formed by applying a resin liquidcontaining a red fluorescent material.

In particular, in a case where the green fluorescent material and thered fluorescent material are separately applied, it is possible torealize color adjustment that is higher in accuracy, as compared with acase in which one fluorescent material is used. In the above case, itcan be configured such that a color-adjusting fluorescent layer in whichthe red fluorescent material is contained is formed on a color-adjustingfluorescent layer in which the green fluorescent material is contained.Alternatively, dot positions can be arranged so that the respectivecolor-adjusting fluorescent layers of the green and red fluorescentmaterials do no overlap with each other. In either case, in aconfiguration in which the color-adjusting fluorescent layer 7 is formedin dots, color adjustment by use of two or more color fluorescentmaterials is extremely easy.

In a case where the particulate fluorescent material is applied by theink jet printing method, the chamber 103, in which the resin containingthe fluorescent material is contained, can include a filter. Further,the ink jet apparatus can be an ink jet apparatus that laterallyincludes a chamber, in which a fluorescent material-containing resin isto be contained, so that (i) a particulate fluorescent material whoseparticles are heavier in weight and larger in diameter and/or (ii) aparticulate fluorescent material whose particles form aggregation andare thereby heavier in weight can easily settle in the chamber 103.

The present technology is not limited to the description of theembodiment above, but may be altered by a skilled person within thescope of the claims. An embodiment based on a proper combination oftechnical means altered as appropriate within the scope of the claims isencompassed in the technical scope of the present technology.

For example, the color-adjusting fluorescent layer may be formed inaccordance with a method which makes it possible to perform local orselective application. As such, the color-adjusting fluorescent layercan be formed by using an ink jet apparatus or a jet dispenser, but, inparticular, it is the most preferable that the color-adjustingfluorescent layer be formed in accordance with the ink jet printingmethod using the ink jet apparatus. With the ink jet printing method, itis possible to locally apply the fluorescent material-containing liquid(color-adjusting fluorescent layer) containing the second fluorescentmaterial, in dots whose number ranges from a few to tens. Therefore, itis possible to selectively provide the second fluorescent material in adesired area. Additionally, it is possible to selectively apply thefluorescent material-containing liquid (color-adjusting fluorescentlayer) containing the second fluorescent material, by a given amount.Therefore, it is possible to more accurately perform fine coloradjustment.

In consideration of the above, it is desirable that the light-emittingapparatus of the present technology be configured such that thecolor-adjusting fluorescent layer is formed by applying the fluorescentmaterial-containing liquid containing the second fluorescent material,in accordance with the ink jet printing method. On the other hand, it ispreferable that the method according to the present technology formanufacturing the light-emitting apparatus be configured such that thestep (iii) includes the sub-steps of: applying the fluorescentmaterial-containing liquid containing the second fluorescent material,in dots in accordance with the ink jet printing method; and forming thecolor-adjusting fluorescent layer by curing the fluorescentmaterial-containing liquid thus applied.

Furthermore, it is preferable that the light-emitting apparatus of thepresent technology further includes, between the fluorescentmaterial-containing layer and the color-adjusting fluorescent layer, alayer containing no fluorescent material (no-fluorescentmaterial-containing layer) or a layer containing a less amount of afluorescent material (less-fluorescent material-containing layer).Further, it is preferable that the method according to the presentinvention further includes, between the steps (ii) and (iii), the stepof forming the no-fluorescent material-containing layer or theless-fluorescent material-containing layer.

Also, it is preferable that the light-emitting apparatus of the presenttechnology be configured such that the first fluorescent materialcontains at least a green fluorescent material and a red fluorescentmaterial, and that the second fluorescent material contains at least thegreen fluorescent material. By this, it is possible to prevent adeterioration in brightness of light emitted from the light-emittingapparatus and to easily shift, to a given color, a color of the lightemitted from the light-emitting apparatus.

On the other hand, it is preferable that the method according to thepresent technology be configured so that the color-adjusting fluorescentlayer is formed in dots whose number is increased or decreased based onthe color property measured in the step (ii), and that thecolor-adjusting fluorescent layer is formed in dots whose size isincreased or decreased based on the color property measured in the step(ii). By this, it is possible to extremely minutely perform the coloradjustment.

Additionally, it is preferable that the light-emitting apparatus of thepresent technology be configured such that the second fluorescentparticle is powder and coated with a first light-transmissive resin thatis in a solid state. Further, it is preferable that the method accordingto the present invention be arranged so that the second fluorescentmaterial is powder and coated with a light-transmissive resin that is ina solid state. By these, it is possible to reduce aggregation ofparticles of the fluorescent material, and to uniform a fluorescentmaterial concentration in the coating liquid.

Note that it is preferable that a particle of powder being made of thesecond fluorescent material coated with the first light-transmissiveresin contain one to three particles of the second fluorescent material,so that it is possible to prevent a case in which the particles of thepowder become too large and causes clogging of a nozzle, e.g., thenozzle of the ink jet apparatus, via which the second fluorescentmaterial is discharged during the step of forming the color-adjustingfluorescent layer.

Moreover, it is preferable that the light-emitting apparatus of thepreset technology be configured such that a particle of powder beingmade of the second fluorescent material coated with the firstlight-transmissive resin have a spherical shape or an oval shape.Further, it is preferable that the method according to the presentinvention be arranged such that a particle of powder being made of thesecond fluorescent material coated with the light-transmissive resinhave a spherical shape or an oval shape.

By the above, because each of the particles of the powder has thespherical shape or the oval shape, the particles of the powder can beuniform in shape and diameter. Thus, it is possible to reduce thewearing-off of a nozzle, e.g., the nozzle of the ink jet apparatus, viawhich the second fluorescent material is discharged in the step offorming the color-adjusting fluorescent layer. Additionally, because theparticles having the spherical shape or the oval shape can be stablydischarged, it is possible to suitably control a thickness or dimensionsof the color-adjusting fluorescent layer to be formed.

Furthermore, it is preferable that the light-emitting apparatus of thepresent technology be configured such that the color-adjustingfluorescent layer be formed from (i) the powder being made of the secondfluorescent material coated with the first light-transmissive resin, and(ii) a second light-transmissive resin.

The example embodiments presented herein can be suitably used not only(i) in a field of a light-emitting apparatus that includes alight-emitting element in combination with a fluorescent material butalso (ii) in a field of a method for manufacturing the light-emittingapparatus. In the filed of the method, the present embodiments can beparticularly suitably used in a filed related to a method for carryingout color adjustment. Furthermore, the present embodiments can be widelyused in (i) a field of a variety of electrical apparatuses, such as amobile telephone including the light-emitting apparatus, and (ii) afield of a method for manufacturing the variety of the electricalapparatuses.

BRIEF DESCRIPTION OF REFERENCE NUMERALS

-   1. Substrate-   2. First surface (mounting surface)-   3. LED chip (light-emitting element)-   4. Wire-   5. Layer that contains fluorescent material (fluorescent    material-containing layer)-   6. Light-transmissive silicone resin layer (layer containing no    fluorescent material, no-fluorescent material-containing layer)-   7. Color-adjusting fluorescent layer-   10, 10 a, 10 b, 30, 30 a, 40, 50. Light-emitting apparatus-   21. Resin powder that contains green fluorescent material-   22. Fluid light-transmissive silicone resin-   23. Applying liquid of color-adjusting fluorescent material-   41. Insulating substrate (substrate)-   43. Protective element-   44. Layer that contains fluorescent material (fluorescent    material-containing layer)-   51. Layer that contains fluorescent material (fluorescent    material-containing layer)-   52. Layer that contains less fluorescent material (less-fluorescent    material-containing layer)

What is claimed is:
 1. A light-emitting apparatus comprising: asubstrate; a plurality of light-emitting elements mounted on a mountingsurface of the substrate; a fluorescent material-containing layercomprising a resin containing a first fluorescent material; and aplurality of color-adjusting fluorescent layers containing a secondfluorescent material, wherein: the fluorescent material-containing layeris plate-like, and is provided on the mounting surface of the substrateso as to directly cover the plurality of light-emitting elements and tobe in contact with a side surface of each of the plurality oflight-emitting elements; and the plurality of color-adjustingfluorescent layers are provided on a surface of the fluorescentmaterial-containing layer in an island-like manner so as to cover only aportion of the surface of the fluorescent material-containing layer. 2.The light-emitting apparatus as set forth in claim 1, wherein, in aplanar view, a portion of the plurality of color-adjusting fluorescentlayers or all of the plurality of color-adjusting fluorescent layersoverlap with the plurality of light-emitting elements.
 3. Thelight-emitting apparatus as set forth in claim 1, wherein, in a planarview, a shape of the fluorescent material-containing layer is either ahexagon, a circle, a rectangle, or a square.
 4. A method formanufacturing a light-emitting apparatus as set forth in claim 1,wherein the method comprises a step of providing the plurality ofcolor-adjusting fluorescent layers on the surface of the fluorescentmaterial-containing layer in an island-like manner by an ink jetprinting method.